STANNOL 低残留助焊膏mulifix450-01 mulifix450-01

STANNOL mulifix450-01无卤素环保助焊膏，专门用于手机、主板维修等。
*残留物极低，焊后残留物基本挥发掉。阻抗高，焊后无需清洗。
*焊后不氧化，阻值高。不含卤素(F/CL/Br/I)物质等优点。
*本膏体黏度低，颗粒度微细，一般在20-30μm。

*完全代替市面上所有维修手机、主板的各类助焊膏。

Stannol mulifix 450-01 specially developed to rework and repair. It is a kind of resin matrix, not clean, flux, suitable for manual and automatic allocation, has good printing eligibility and good dispensibility. Very low activation energy flux residue in produce good insulation reaction after welding. To plastic 450-01 fast dry residue, not sticky.