纳米压印胶 纳米压印胶

IPNR-T1000 Thermoplastic nanoimprint resist 
热塑型纳米压印胶 
? Sub-10 nm resolution 分辨率低于10nm 
? Low imprint pressure (< 20 bar) 低压力压印(< 20 bar) 
? Low imprint temperature (< 100 ℃) 低温压力(< 100 ℃) 

IPNR-T2000 Thermal curable nanoimprint resist 
热固化型纳米压印胶 
? Sub-10 nm resolution 分辨率低于10nm 
? Low imprint pressure (< 1 bar) and Low curing temperature (< 100 ℃) 低压力压印(< 1 bar)以及低固化温度(< 100 ℃) 
? Short thermal curing time (< 60 s) 热固化时间短(< 60 s) 
? High O2 Plasma etching resistance 高氧等离子体刻蚀电阻 
? Uniform film thickness 均一的膜厚度 

IPNR-PC1000 Photo-curable nanoimprint resist (Free radical initiation) 
光固化型纳米压印(自由基引发) 
? Acrylate functionalized polysiloxane based resist 丙烯酸酯官能化聚硅氧烷抗蚀剂 
? Vacuum or Nitrogen atmosphere operation 真空或者氮气气氛下操作 
? Sub-10 nm resolution 低于10nm的分辨率 
? Low imprint pressure (< 1 bar) and ultra-fast curing time (< 10 s) 低压力压印以及超快固化时间(< 10 s) 
? Low UV-exposure dose 低紫外照射量 
? High O2 Plasma etching resistance 高氧等离子体刻蚀电阻 
? Uniform film thickness 均一的膜厚度 

IPNR-PC2000 Photo-curable nanoimprint resist (cation intiation) 
光固化纳米压印蚀剂(阳离子引发) 
? Vinyl ether functionalized polysiloxane based resist 乙烯基醚官能化聚硅氧烷抗蚀剂 
? Air atmosphere operation 空气气氛下操作 
? Sub-10 nm resolution 分辨率低于10nm 
? Low imprint pressure (< 1 bar) and ultra-fast curing time (< 1 bar) 低压力压印(< 1 bar)以及超快固化时间(< 1 bar) 
? Low UV-exposure dose 低紫外照射量 
? High O2 Plasma etching resistance 高氧等离子体刻蚀电阻 
? Uniform film thickness 均一的膜厚度 

IPNR-UL1000 Under-layer polymer 
举离型传递层材料 
? Thermoplastic polymer for lift off process 热塑聚合物发送过程 
? Strong adhesion to up layer resists and substrates 强粘附抗蚀剂层以及材料 

IPNR-UL2000 Under-layer polymer 
刻蚀型传递层材料 
? Thermoset polymer for etching mask process 热固性聚合物刻蚀面罩过程 
? Strong adhesion to up layer resists and substrates 强粘附抗蚀剂层以及材料 

IPNR-UPM Quick mold fabrication material 
快速模板制作材料 
? Quick and easy mold fabrication 快速而简单的塑造材料 
? High resolution and low cost 高分辨率以及低成本 
? Superb chemical and temperature resistance 极好的化学性以耐温性 
? Excellent adhesion to mold substrate 塑造优良的附着力基板 
? Reliable mold release property 可靠的脱模性 

IPNR-AP Chlorosilane based adhesion promoter 
氯硅烷增粘剂 
? Promoting adhesion between resists and substrates 促进和基材之间的附着力 
? Vapor phase or solution processing 气相或者液相处理