产品详情
简单介绍：
EW8003 NoSWEEP™ Wire Bond Encapsulant
详情介绍：
Structural epoxy adhesive with high strength & durability. Particularly useful for demanding bonding applications requiring very high performance properties. Tough, impact resistant, good adhesion to many metals, ceramics, & thermosetting plastics. Thermally curable.
MSDS / Technical Data Sheets / Product Literature
- dataData Sheet #680
- litHigh Performance Adhesives
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