产品详情
简单介绍:
SF5002 LoSTRESS™ Liquid Encapsulant
详情介绍:
Low modulus, flame retardant fill material specifically designed to offer low cure stress & low warpage. 100% solids, epoxy based liquid encapsulant designed for encapsulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organic.
MSDS / Technical Data Sheets / Product Literature
- dataData Sheet #638
- litHigh Performance Adhesives
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