产品详情
简单介绍:
SF503A OptiCLEAR™ Liquid Encapsulant Fill
详情介绍:
Liquid encapsulant fill material specifically designed to offer efficient light transmission & low cure stress. 100% solids, unfilled, liquid encapsulant designed for encapsulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organic. UV or thermally curable.
MSDS / Technical Data Sheets / Product Literature
- dataData Sheet #668
- litHigh Performance Adhesives
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