产品详情
简单介绍:
SF5021 OptiCLEAR™ Liquid Encapsulant Fill
详情介绍:
Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organice. UV or thermally curable.
MSDS / Technical Data Sheets / Product Literature
- dataData Sheet #881
- litHigh Performance Adhesives
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