产品详情
简单介绍：
SD54G0 EdgeCONTROL™
详情介绍：
Low modulus retention dam specifically formulated to offer low cure stress & low warpage for liquid encapsulation of BGA & MCM packages. Good adhesion to various rigid and flexible organic & ceramic substrates, high viscosity, high thixotropy, & thermally curable. Designed to be used with LoSTRESSTM liquid encapsulant.
MSDS / Technical Data Sheets / Product Literature
- dataData Sheet #681
- litHigh Performance Adhesives
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