产品详情
简单介绍：
SD8002 EdgeCONTROL™
详情介绍：
100% solids, liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants & other bonding uses requiring minimal flow during curing. Dimensional stability, low stress, & thermally curable.
MSDS / Technical Data Sheets / Product Literature
- dataData Sheet #927
- litHigh Performance Adhesives
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