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- 产品名称:SYJ-800 Precision CNC Dicing / Cutting Saw with Digital Controller
- 产品型号:SYJ-800
- 产品展商:Shenyang Kejing Auto-Instrument Co., LTD
- 产品文档:无相关文档
- 发布时间:2018-07-29
- 在线询价
简单介绍
SYJ-800 Precision CNC Dicing / Cutting Saw with Digital Controller is mainly used for dicing and cutting all kinds of crystal, glass, ceramic, mineral, metal. Cutting accuracy can reach to 0.02mm.
SYJ-800 Precision CNC Dicing / Cutting Saw with Digital Controller can realizethe computerized 3D automatic control.
产品描述
Click here to watch demo video
Product introduction:SYJ-800 is a CE certified dicing saw, designed for dicing and cutting almost all kinds of materials up to 8" diameter wafer or components. The SYJ-800 saw use precision stepper motor, the cutting accuracy can be reached 0.02mm and can be programmable with position accuracy of 0.01 mm in X, Y.Z three dimension ,the sample stage was made of vacuum plate and can be rotated by an electric motor to cut sample at any angle with +/- 0.1°tolerance. Different cutting blades can be selected by different materials, the circulating water can prevent the sample from tissue changing or even damaging by the temperature increasing. It is an excellent tool for dicing Al2O3 ceramic sheet and Si or Ge wafer for electronic substrates and solar power panels. This machine can select Laptop with software and USB cable as controller.It is small in size and saves laboratory spaces. It is easy to operate and suitable for beginners.
SPECIFICATIONS
Product Name
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SYJ-800 Precision CNC Dicing / Dicing Saw with Digital Controller and Complete Accessories
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Input Voltage and Power
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AC 220V, 180W
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Motor
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High torque DC motor with 0-3000.rpm
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Dicing Blades
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Three diamond blades are included:
One 4"O.Dia×0.014"(0.35mm) (thickness)×0.5"I. Dia arbor fully sintered diamond blade
Two 4" O.Dia × 0.014"(0.35mm) (thickness) × 0.5"I. Dia arbor edge sintered diamond blade
Two water splashing protectors are included. One for 4" blade and the another one is for 6" blade
One Ø86mmO.Dia×Ø70mmI.Dia×0.15mm ultra-thin diamond blade was include for dicing Si, Ge, GaAs and quartz, LiNbO3 wafers etc..
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Effective Dicing Range
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1. 3 dimension: X-axis: 200㎜(8" ) Y-axis:200㎜(8" ) Z-axis:55㎜(2.2")
2. Dicing Depth: depended on cutting blade diameter:
3. Max dicing depth with ultra-thin diamond blade was 1mm.
4. Max cutting depth with normal blade was 10mm(partial areas can be reached 30mm)
5. Rotation: 360° by motor with ±0.1°accuracy(rotate speed/degree programmable)
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Moving/Cutting Speed Range
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X-axis: 1-50mm/min adjustable
Y-axis: 1-50mm/min adjustable
Z-axis: 1-50mm/min adjustable
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Accuracy
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0.0025 mm moving resolution and 0.01 mm position accuracy.
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PC software
(Optional)
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1. Labtop and PC software are provided with the equipment.
2. Cutting parameters can be set in the software such as cutting length, width, time, feed speed, kerf loss, etc. Rotation is controlled independently.
3. Manual or programmable control mode compatible with Win 7 / 8 / 8.1
4. Click pic left to view software interface.
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Sample Stage and Holder
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One 220mm diameter glass sample plate and 8" vacuum chuck are included
( The glass sample plate has a flat surface which can be soaked and hold in position by a vacuum chuck. Also, the glass plate can prevent the vacuum chuck from being damaged by saw blade during cutting process.)
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Water Cooling
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Assemblies of water jetting, draining, and splashing protection is included.
The optional Coolant Circulating Tank is NOT included, you can order it at extra cost.
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Net Weight
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55 kg(121.3lbs)
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Shipping Weight
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290 lbs
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Dimensions
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Machine: 700 ×530 ×750 mm (27.6"L×20.9"W ×29.5"H)
Control box: 340 ×260 ×190 mm(13.4"L×10.2"W×7.5"H)
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Shipping Dimension
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(1397 ×991 ×1118 mm )55''×39"×44"
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Warranty
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One year limited with lifetime support --- including all electronic and mechanical parts. Damaged parts caused by misuse: such as rusted part from inadequate storage and broken parts by the user are not covered by the standard warranty.
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Certification
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CE Certified.
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Application Notes
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For cutting the sticky materials such as non-ferrous alloy, epoxy, and plastic, we must sharp diamond blade open, or cut sample along with the included dressing stone (Glue sample and the dressing stone side by side and cut them together. which will help keep the blade sharp enough for efficient cutting.
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