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  • 入驻时间:2012-06-05
  • 联系人:康冉德
  • 电话:024-23826163-811
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VTC-600-2HD DC/RF Dual-Head High Vacuum 2”Magnetron Plasma Sputtering Coater

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  • 产品名称:VTC-600-2HD DC/RF Dual-Head High Vacuum 2”Magnetron Plasma Sputtering Coater
  • 产品型号:VTC-600-2HD
  • 产品展商:Shenyang Kejing Auto-Instrument Co., LTD
  • 产品文档:无相关文档
  • 发布时间:2018-09-05
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简单介绍
VTC-600-2HD DC/RF Dual-Head High Vacuum 2”Magnetron Plasma Sputtering Coater is the newly developed coating equipment and used for single layer or multilayer ferroelectric thin film, preparation of conductive film, alloy, semiconductor, ceramic, dielectric etc. VTC-600-2HD DC/RF Dual-Head High Vacuum 2”Magnetron Plasma Sputtering Coater is suitable for OLED and solid electrolytes.
产品描述

Product introduction:VTC-600-2HD is a high vacuum coating equipment which is newly developed by our company. It is a compact magnetron sputtering system with dual 2" target sources, e.g., one DC source for coating metallic film, and the other RF source for coating non-metallic material. This coating system is designed for coating both single or multiple film layers for a wide range of materials, such as alloy, ferroelectric, semiconductor, ceramic, dielectric, optical, PTFE, etc.Compared with similar equipment, it has the advantages of small size and easy operation, and can be used at a wide range of materials. It is an ideal equipment for preparing various types of material films in the laboratory.

SPECIFICATIONS

Product Name

VTC-600-2HD DC/RF Dual-Head High Vacuum 2” Magnetron Plasma Sputtering Coater

Compact Structure

          

Input/Output Voltage and Power

1. Input voltage:AC220V50Hz/60Hz

2. Total Power:<2Kw


Source Power

Two sputtering power sources are integrated into one control box

1. DC source: 500 W power for coating metallic materials

2. RF source: 300 W power, for coating non-conductive materials

Sputtering power source is optional, you can choose two DC sources, you can also choose two RF sources, or choose one DC one RF sources.

Magnetron Sputtering Head

1. Two 2" Magnetron Sputtering Heads with water cooling jackets and shutters are included .

2. One is connected to DC source for coating metallic materials

3. The other one is connected to RF source for non-conductive materials

4. Target size requirement: 2" diameter

5. Target cooling mode: water cooling

6. Thickness range: 0.1 - 5 mm for both metallic and non-conductive targets (including backing plate)

7. Customized coater: Two DC heads without RF; two RF heads without DC; 3 RF heads are available upon request

Sample Stage

1. Sample holder is a rotatable and heatable stage

2. Sample holder size: 140 mm Dia. for. 4" wafer max

3. Rotation speed: 1 - 20 rpm adjustable for uniform coating

4. The holder temperature is adjustable from RT to 500 °C max with accuracy ±1.0 °C via a digital temperature controller

Gas Flow Control

1. Two precision mass flow controllers (MFC) are installed to allow inlet of two types of gasses .

2. Flow rate:One flow rate is 100SCCM,the other flow rate is 200SCCM

Vacuum Pump Station

Power of theVacuum Pump :300W

Water Chiller

Power of the Water Chiller:350W

Optional

1. Precise quartz Film Thickness Monitor is optional, which can be into the chamber to monitor coating thickness with an accuracy of 0.10 Å

2. Precision Thin Film & Coating Analysis Systems is available at extra cost

3. Various 2” oxide and metallic targets are available upon request at extra cost. Silver epoxy and copper backing plates can be ordered at MTI

             

Overall Dimensions

 Host Dimension:500mm×560mm×660mm20" × 22" × 26"

Total Dimension:1300mm×660mm×1200mm52" × 26" × 48"

Net Weight of Coater

160 kg

Compliance

CE approval

Warranty

One year limited warranty with lifetime support

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