多芯片阵列封装:CS
ree-beam Packages B-Mount Q-Mount F-mount 9.0mm (no PD) 9.0mm (no PD) Special (*1) TO-3 (no TEC) TO-3 (with TEC & thermistor) HHL w/ TEC (*5) Add PD (9mm, TO-3, BFC) (*4) Add thermistor (9mm, TO-3, BFC) Fiber-cupled Packages 9mm SMA (*7) 2-pin FC package 8-pin Butterfly (-BFC) HHL w/ TEC + Fiber High Brightness Option (3) Others FAC Lensing <2° FWHM Low AR Facet Coating NRE (*2) TEC cold plate for FCP, BFC, C-mount Internal TEC in butterfly package (*6)
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