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洁净干燥箱CLH系列

洁净干燥箱CLH系列
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  • 产品名称:洁净干燥箱CLH系列
  • 产品型号:CLH-21CD(Ⅲ),CLH-21CDH(Ⅲ),CLH-21CD(Ⅴ),CLH-35CD(Ⅲ),C
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简单介绍
洁净干燥箱CLH系列 Excellent heat efficiency and temperature uniformity The best for semiconductor wafers and glass substrate Inert gas introduction available
产品描述


洁净干燥箱CLH系列:
High Temperature Clean Room Oven CLH Series

Maximum temperature

By the combination of the heat-resistant filter and cooling system, clean process in high temperature and operation temperature 450 deg-C is available. The best for wafer process, optical memory disc and liquid crystal.

High Temperature Clean Room Oven CLH Series
 
  • Excellent heat efficiency and temperature uniformity
  • The best for semiconductor wafers and glass substrate
  • Inert gas introduction available
 
  • ApplicationsBaking and curing for semiconductor wafers and glass substrate
  • OptionsOxygen concentration meter, signal tower, cold trap, emergency stop, water leaking
    detector
The combination of heat-resistant high performance filter and original cooling system
CLH series specifications
CleanessCLASS100(temperature stable time)
/ CLASS500(up and down temperature time)
Oxygen concentrationLess than 20 ppm
System controlProgrammed controller
Accuracy±0.1%FS±1digit
Recipes19 (30segment/recipe)
Temperature controlAuto tuning PID control
Shelf plate
withstand load
15kg/shelf
Chamber pressure meter0~2kPa
Filter pressure meter0~1kPa
ThermocoupleType-K
Exhaust port1B/ball value
Safety featureElectric leak breaker, heat protection, motor over-load protection,
control circuit breaker, cooling water flow meter
Accessories2 shelves (with shelf plates)

 
 CLH-21CD()CLH-21CDH()CLH-21CD()
MethodConvection (side-flow)Convection rear to front
Maximum temperature(*1)450 deg-C530 deg-C500 deg-C
Operation temperature(*1)RT+70~450 deg-CRT+70~530 deg-CRT+70~500 deg-C
Temperature distribution(*2)±5(at 450)deg-C±8(at 530)deg-C±5(at 500)deg-C
Heat up time(*1)Within 80 minutes (RT+70~450 deg-C)Within 90 minutes (RT+70~530 deg-C)Within 80 minutes (RT+70~500 deg-C)
Cool down time
(Reference)
Within 90 minutes (450~100 deg-C)Within 100 minutes (530~100 deg-C)Within 90 minutes
(500~100 deg-C)
FilterHeat-resistant HEPA filter
O2 concentration20ppm within 45 minutes (N2⋅150L/min introduce)
Heater power33.6kW(at 200V)21kW(at 200V)
Temperature recorder1 pen temperature recorder (control point)
Outside dimension(mm)1285(W)×2020(H)×1605(D)1180(W)×2110(H)×1670(D)
Inside dimension(mm)670(W)×700(H)×500(D)700(W)×700(H)×500(D)(*3)
Equipment weightAbout 1050kgAbout 1100kg
Breaker capacityAC 200V 150A 3 phases 50/60 HzAC 200V 75A 3 phases 50/60 Hz

 
 CLH-35CD()CLH-35CDH()
MethodConvection (Side-flow)
Maximum temperature(*1)450 deg-C530 deg-C
Operation temperature(*1)RT+70~450 deg-CRT+70~530 deg-C
Temperature distribution(*2)±5 (at 450 ) deg-C±8 (at 530 ) deg-C
Heat up time (*1)Within 70 minutes
(RT+70~450 deg-C)
Within 120 minutes
(RT+70~530 deg-C)
Cool down time (Reference)Within 100 minutes
(450~100 deg-C)
Within 120 minutes
(530~100 deg-C)
FilterHeat-resistant HEPA filter
O2 concentrationWithin 50 minutes (N2⋅250L/min introduce)
Heater power48.3kW(at 200V)
Temperature recorder1 pen temperature recorder (control point)
Outside dimension(mm)1285(W)×2080(H)×1775(D)
Inside dimension(mm)670(W)×790(H)×670(D)
Equipment weight1250kg
Breaker capacityAC 200V 175A 3 phases 50/60 Hz

(*1) Heat-up available temperature is figures at control point in a heating chamber.
(*2) Valid dimension is two-thirds inside dimension.
(*3) Inside width is 700 mm, opening width is 630 mm.


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